RUV Crack Analyses

A resonance vibration approach is developed to measure residual stress non-destructively in full-size multi-crystalline silicon wafers used in solar cell manufacturing. This method is based on excitation of longitudinal resonance ultrasonic vibrations in the material using an external piezoelectric transducer combined with high-sensitive ultrasonic probe and data acquisition of the frequency response to make the method suitable for in-line diagnostics during solar cells and modules manufacturing. Theoretical and experimental analysis of the vibration mode in single-crystal and multi-crystalline silicon wafers is used to provide a benchmark reference analysis and validation of the approach.

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