The Resonance Ultrasonic Vibrations (RUV) technique was developed for off-line and in-line non-destructive crack and flaw detection in full-size silicon wafers for solar cells and ceramic plates for fuel cells. The RUV methodology relies on deviation of the resonance frequency response curve measured on a substrate with micro damage (such as Si-wafer or a ceramic plate containing a micro-crack) and on identical undamaged substrate.

The RUV technology allows to (1) reject mechanically unstable wafers after ingot cutting or ceramic plates before they are introduced into further cell processing, (2) identify samples with mechanical flaws (such as cracks) during production to avoid their in-line breakage and yield reduction, and (3) detect cracked solar and fuel cells before they will be combined into modules to avoid efficiency reduction and product return from the field.

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Ultrasonic Technologies
2664 Cypress Ridge Blvd, Suite 103
Wesley Chapel, FL 33544 USA
Phone: (813) 973-1702
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