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Full Paper - 37th IEEE PVSC Conference - Seattle, Washington, June 2011
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UST Poster - 37th IEEE PVSC Conference - Seattle, Washington, June 2011
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Effect of Handling Stress on Resonance Ultrasonic Vibrations in Thin Silicon Wafers -
Hao Wu, Shreyes N. Melkote, Anton Belyaev, Igor Tarasov, Deven Cruson and Sergei Ostapenko, (2010) Proceedings of the 35th IEEE Photovoltaic Specialists Conference, Honolulu
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Breakage Reduction in Solar Cell Production Using Resonance Ultrasonic Vibration Inspection -
Sergei Ostapenko, Anton Belyaev, Yusuf Emirov, Igor Tarasov, Mark Verstraten, Michel van Dooren, Pier Giuseppe Fumei, Guus van Veghel, Arvid van der Heide, (2009) Proceedings of the 34th IEEE Photovoltaic Specialists Conference
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Resonance Ultrasonic Vibrations for In-line Crack Detection in Silicon Wafers and Solar Cells -
A. Monastyrskyi, S. Ostapenko, O. Polupan, H. Maeckel, and M. A. Vazquez, (2008) Proceedings of 33rd PVSC
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Resonance Ultrasonic Vibrations for Crack Detection in Photovoltaic Silicon Wafers -
W. Dallas, O. Polupan, and S. Ostapenko, (2007)
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Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers -
A. Belyaev, O. Polupan, W. Dallas, S. Ostapenko and D. Hess,
Applied Physics Letters 88, 111907 (2006)
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Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafers -
A. Belyaev, O. Polupan, S. Ostapenko, D. Hess and J. P. Kalejs,
Institute of Physics Publishing, Semicond. Sci. Technol. 21 (2006) 254–260
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Residual stresses in polycrystalline sheet silicon and it's relation to lifetime -
S. He, S. Danyluk, I. Tarasov, S. Ostapenko
Center for Microelectronics Research, University of South Florida, March 11, 2005
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Nonlinear resonance ultrasonic vibrations in Czochralski-silicon wafers -
S. Ostapenko and I. Tarasov,
Applied Physics Letters, Volume 76, Number 16, 17 April 2000
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